PCS Series Mixing Extruder for Semiconductor Encapsulation Materials
A continuous kneader optimal for compounds of semiconductor encapsulants based on thermosetting resins, achieved through precise temperature control.
Epoxy molding compound (EMC) is an optimal encapsulant for protecting various electronic components such as integrated circuits (ICs), diodes, transistors, and semiconductors. Its excellent electrical, mechanical, and chemical properties make this material suitable for electrical products and automotive applications. To fully utilize the outstanding quality of EMC, a kneading device that can effectively disperse high-fill fillers under low and fully controlled temperature conditions is required. Buss's kneading technology has continued to meet such advanced demands for the past 60 years, and its high performance has been demonstrated in the molding of compounds based on thermosetting resins such as epoxy resins, phenolic resins, polyester resins, melamine resins, and urea resins.
- Company：ブッス・ジャパン
- Price：Other
